• Intel XEON CPU QC X5550 8M CACHE - 2.66 GHZ - 6.40 GT/S QPI - BX80602X5550

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Intel

Intel XEON CPU QC X5550 8M CACHE - 2.66 GHZ - 6.40 GT/S QPI - BX80602X5550

Processor X5550 (8M Cache - 2.66 GHz - 6.40 GT/s Intel® QPI)
SKU: BX80602X5550
Condition: Bulk
Overview:
Intel Xeon X5550. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 1366 (Socket B), Component for: Server/workstation. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm², Physical Address Extension (PAE): 40 bit. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm. Processor package size: 42.5mm x 45mm

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NOTE: The information below is provided for your convenience only, accuracy of specifications cannot be guaranteed. But if necessary, please verify with us before purchasing. Data provided by 1 World Sync

General
Processor family
Intel® Xeon® 5000 Sequence
Processor socket
LGA 1366 (Socket B)
Component for
Server/workstation
Memory channels
Triple-channel
Maximum internal memory supported by processor
144 GB
Maximum internal memory
147456 MB
Memory types supported by processor
DDR3-SDRAM
Number of Processing Die Transistors
731 M
Processing Die size
263 mm²
Physical Address Extension (PAE)
40 bit
Package width
44 mm
Package depth
140 mm
Package height
117 mm
Processor package size
42.5mm x 45mm mm
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Intel Xeon X5550. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 1366 (Socket B), Component for: Server/workstation. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm², Physical Address Extension (PAE): 40 bit. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm. Processor package size: 42.5mm x 45mm

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General
Processor family
Intel® Xeon® 5000 Sequence
Processor socket
LGA 1366 (Socket B)
Component for
Server/workstation
Memory channels
Triple-channel
Maximum internal memory supported by processor
144 GB
Maximum internal memory
147456 MB
Memory types supported by processor
DDR3-SDRAM
Number of Processing Die Transistors
731 M
Processing Die size
263 mm²
Physical Address Extension (PAE)
40 bit
Package width
44 mm
Package depth
140 mm
Package height
117 mm
Processor package size
42.5mm x 45mm mm

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