Cooler Master MasterGel Pro V2 heat sink compound 9 W/m
g/cm3 - 1.5ml - Grey
Brand: Cooler Master
SKU: MGY-ZOSG-N15M-R3
$71.88
Price as listed. Shipping charges calculated at checkout.
In stock
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NOTE: The information below is provided for your convenience only; the accuracy of the specifications cannot be guaranteed. However, if necessary, please check with us before purchasing. Data provided by 1 World Sync.
General
Type
Thermal paste
Thermal conductivity
9 W/m·K
Density
2.6 g/cm³
Volume
1.5 ml
Weight
4 g
Quantity per pack
1 pc(s)
Package width
82 mm
Package depth
200 mm
Cooler Master MasterGel Pro V2. Type: Thermal paste, Thermal conductivity: 9 W/m·K, Density: 2.6 g/cm³. Volume: 1.5 ml, Weight: 4 g. Quantity per pack: 1 pc(s), Package width: 82 mm, Package depth: 200 mm
| Estimate Gross Weight | 0.011 |
|---|
https://www.coolermaster.com/catalog/coolers/thermal-grease/mastergel-pro-v2/#image-Item8
High Thermal Conductivity Compound
High Quality That Runs Your Computer Smoothly
MasterGel Pro V2, an upgraded compound of its old version with high CPU/GPU conductivity, providing better heat dissipation as well as improving heat transfer form chipset to cooler base. Apart from aesthetic design the thermal grease has been adjusted to match your performance needs.
High Performance
Upgraded compound improves heat transfer from chipset to cooler base or heat pipes
W/m.k = 9
Easy To Spread
Easy to spread and remove without damaging the surface
High Thermal Conductivity Compound
High Quality That Runs Your Computer Smoothly
MasterGel Pro V2, an upgraded compound of its old version with high CPU/GPU conductivity, providing better heat dissipation as well as improving heat transfer form chipset to cooler base. Apart from aesthetic design the thermal grease has been adjusted to match your performance needs.
High Performance
Upgraded compound improves heat transfer from chipset to cooler base or heat pipes
W/m.k = 9
Easy To Spread
Easy to spread and remove without damaging the surface
- Upgraded compound for better heat dissipation
- High CPU/GPU conductivity (9 W/m.k)
- Improves heat transfer from chipset to cooler base or heat pipes
- Easy to spread and remove without damaging the surface
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